Real Time With... IPC Midwest 2012
Video Index

Here is a listing of all the videos from this show. Click on a thumbnail or video title to view a video.
PCB
AT&S, Jim Sierakowski

AT&S: Coming to America
International Account Manager Jim Sierakowski talks about the company's efforts to gain a foothold in the U.S. market, providing OEMs and EMS companies with a variety of PCBs from their factories around the world.
IPC, John Mitchell

IPC's John Mitchell
New IPC president John Mitchell talks about his mandate from the board of directors, his qualifications for the job, and some of the efforts already underway.
IPC, Marc Carter

Standards Development for Printed Electronics
Marc Carter discusses the importance of standards for the electronics industry and IPC's role in standards development. He also discusses the technology of printed electronics and the role IPC is playing in the development of those standards.
IPC, Sree Bhagwat

PCB Industry report highlights trends, analysis.
IPC Market Research Manager Sree Bhagwat discusses the latest comprehensive PCB Industry Report, which includes trends, analysis and forecasting.
IPC, Susan Filz

Upcoming IPC Conferences
Director of Industry Programs Susan Filz walks us through the upcoming conferences for the industry. Lots of excellent opportunities in the next few months.
Iron Atom, Iain Wilson

Automated PreCam in the Cloud
A new start-up has launched a DFM/PreCam service that is based in the cloud. Iron Atom President Iain Wilson describes the service in this exclusive interview with Ray Rasmussen at IPC Midwest. Is this the business model of the future?
MicroCraft, Rick Kaim

MicroCraft Offers Significant Tester Upgrade
Rick Kaim, Technology Manager for MicroCraft, talks about the 50% improvement in speed of their Flying Probe Testers. Kaim also discusses their line of Pluritec drills and Ink Jet Printers.
NanoMaterials Innovation Center, Dr. Alan Rae

NanoMaterials R&D Creates Opportunities in PEC
The development of nanomaterials for printed electronics is creating exciting new structures and making it possible to improve applications that rely on traditional materials. Mainstream applications for non-electronic structures have existed for many years, and Dr. Alan Rae explains how we are starting to see mainstream electronic products improved by or enabled by nanomaterials' unique properties.
Oak-Mitsui, John Andresakis

Developments in Printed Electronics
John Andresakis talks with Ray Rasmussen about Printed Electronics. The IPC has made printed electronics a technology priority and John goes into some of the progress with standards and technologies in the market.
Polar Instruments, Ken Taylor

Polar Instrument Product Updates
Polar Instruments President and CEO Ken Taylor walks editor Ray Rasmussen through some significant software upgrades to Polar's product suites.
Rogers Corporation, John Coonrod

Overcoming Challenges in Laminate Development
John Coonrod, market development engineer for Rogers Corporation, discusses his company's newest development in high-speed, high-frequency laminates. This new material is also halogen-free and compatible with lead-free soldering. John explains the many challenges that had to be met to bring this material to the marketplace.
Solberg Technical Consulting, Vern Solberg

The Proliferation of Embedded Components
Embedded components are becoming more common as the industry movies into the use of handheld and portable products. Vern Solberg talks about the IPC's effort to create an industry standard (D55) that deals with the relevant design and assembly challenges.
Uyemura, Don Walsh

Uyemura Investing and Growing in PCB Industry
The director of operations for Uyemura, Don Walsh, talks about the company's efforts around R&D and product development for the PCB industry.
Uyemura, George Milad

Update IPC Plating Committee 414
IPC Plating Committee Chair George Milad updates us on the progress of the Plating Committee. The adopted standard for ENIPIG is the latest accomplishment of this critical IPC effort.
Ventec USA, Bruce Hurley

LED Market Drives Demand for New Laminates
Ventec's Bruce Hurley discusses how the LED market has driven the demand for materials that transfer heat efficiently. Standards need to be further developed in this area. Apples to apples product comparisons are a challenge right now and long-term reliability studies need continue to be conducted.
EMS
Apex Factory Automation, William Crist

Solder Paste Inspection System Introduced
Sales and support manager William Crist provides an overview of a newly introduced solder paste inspection system for the U.S. market.
BEST Inc., Bob Wettermann

BGA Symposium Draws Good Crowd
BEST held a successful BGA symposium at IPC Midwest 2012. President Bob Wetterman discusses the content and "takeaways" from the event, as well as attendees' concerns, including DFM for BGAs
DEK, Brian Smith

DEK Helps Companies Work Smarter
GM for North America Brian Smith talks about the company's relatively new products, their functionality, along with their ease of integration into exisiting processes.
Elantas, Sue Graham

Elantas Has Long History of Innovation
Elantas CEO Sue Graham and Editor Ray Rasmussen discuss the company's many years of innovation and industry support.
IPC, Fern Abrams

Update on Conflict Minerals
Director of Government Relations Fern Abrams provides an update on the latest with the conflict minerals regulations. The final draft is about to hit the street.
IPC, Sharon Starr

IPC's On-shoring Report Now Available
Is on-shoring a reality? IPC's Director of Market Research, Sharon Starr, discusses the organization's new report, "On-Shoring in the Electronics Industry: Trends and Outlook for North America."
L3 Communications, Robert Fornefeld

Reliability training programs
L3 has embarked on a series of training programs designed to enhance product reliability and productivity. Rob Fornefeld talks about the program, how it got started and where it is today.
MyData, Nico Coenen

Jet Solder Paste Printing
MyData's global sales director for Jet Printing, Nico Coenen, talks about the advantages of Jet Solder Paste Printing. While not perfect for every application, this technology is gaining more and more acceptance in the industry.
Ray Prasad Consultancy Group, Ray Prasad

Ray Prasad gives BGA Standards Update
Ray Prasad is chairman of the IPC-7095 committee, which revises and updates the standard on BGA assembly. The standard needed updating because of technology changes regarding finer-pitch BGA technology. Ray discusses how to address technical issues related to BGAs, including pad cratering and head-in-pillow defects.
Featured
AT&S, Jim Sierakowski

AT&S: Coming to America
International Account Manager Jim Sierakowski talks about the company's efforts to gain a foothold in the U.S. market, providing OEMs and EMS companies with a variety of PCBs from their factories around the world.
IPC, Fern Abrams

Update on Conflict Minerals
Director of Government Relations Fern Abrams provides an update on the latest with the conflict minerals regulations. The final draft is about to hit the street.
IPC, John Mitchell

IPC's John Mitchell
New IPC president John Mitchell talks about his mandate from the board of directors, his qualifications for the job, and some of the efforts already underway.
IPC, Marc Carter

Standards Development for Printed Electronics
Marc Carter discusses the importance of standards for the electronics industry and IPC's role in standards development. He also discusses the technology of printed electronics and the role IPC is playing in the development of those standards.
IPC, Sharon Starr

IPC's On-shoring Report Now Available
Is on-shoring a reality? IPC's Director of Market Research, Sharon Starr, discusses the organization's new report, "On-Shoring in the Electronics Industry: Trends and Outlook for North America."
IPC, Susan Filz

Upcoming IPC Conferences
Director of Industry Programs Susan Filz walks us through the upcoming conferences for the industry. Lots of excellent opportunities in the next few months.
L3 Communications, Robert Fornefeld

Reliability training programs
L3 has embarked on a series of training programs designed to enhance product reliability and productivity. Rob Fornefeld talks about the program, how it got started and where it is today.
NanoMaterials Innovation Center, Dr. Alan Rae

NanoMaterials R&D Creates Opportunities in PEC
The development of nanomaterials for printed electronics is creating exciting new structures and making it possible to improve applications that rely on traditional materials. Mainstream applications for non-electronic structures have existed for many years, and Dr. Alan Rae explains how we are starting to see mainstream electronic products improved by or enabled by nanomaterials' unique properties.
Rogers Corporation, John Coonrod

Overcoming Challenges in Laminate Development
John Coonrod, market development engineer for Rogers Corporation, discusses his company's newest development in high-speed, high-frequency laminates. This new material is also halogen-free and compatible with lead-free soldering. John explains the many challenges that had to be met to bring this material to the marketplace.
Solberg Technical Consulting, Vern Solberg

The Proliferation of Embedded Components
Embedded components are becoming more common as the industry movies into the use of handheld and portable products. Vern Solberg talks about the IPC's effort to create an industry standard (D55) that deals with the relevant design and assembly challenges.
Uyemura, Don Walsh

Uyemura Investing and Growing in PCB Industry
The director of operations for Uyemura, Don Walsh, talks about the company's efforts around R&D and product development for the PCB industry.
Uyemura, George Milad

Update IPC Plating Committee 414
IPC Plating Committee Chair George Milad updates us on the progress of the Plating Committee. The adopted standard for ENIPIG is the latest accomplishment of this critical IPC effort.
Ventec USA, Bruce Hurley

LED Market Drives Demand for New Laminates
Ventec's Bruce Hurley discusses how the LED market has driven the demand for materials that transfer heat efficiently. Standards need to be further developed in this area. Apples to apples product comparisons are a challenge right now and long-term reliability studies need continue to be conducted.