Real Time With... IPC Midwest 2009
Video Index

Here is a listing of all the videos from this show. Click on a thumbnail or video title to view a video.
PCB
Bare Board Group (BBG), Greg Papandrew

BBG Introduces Greg Meindl, Midwest Sales
BBG has been making steady progress through the downturn and has recently added long-time PCB pro, Greg Meindl, to manage sales in Illinois, Indiana and Wisconsin.
CCNi, Don DeGroot

High Speed/High Frequency Test Methods Subcommittee
This subcommittee is tasked with developing test methods specifically for evaluating high-speed/high-frequency boards and materials. Don DeGroot talks about a breakthrough in the group's efforts to provide a comprehensive test solution.
Calumet, Stephen Marshall

Calumet is NOT waiting for the phone to ring.
The team at Calumet Electronics have taken the bull by the horns and developed the systems necessary to capture more business in a tough market. Stephen Marshall, National Sales Manager, talks about the strategic investments the company has made and their approach to capture new business and how they take care of their current customers.
Colonial Circuits, Mike Hill

Bare Board Test Committee
When the latest revision of IPC-9252 was released in November '08, the document moved from a "Guideline" to a "Requirement". Listen to Mike Hill, Committee Chairman, as he discusses the new revision and its implications for the industry.
Conductor Analysis Technologies, David Wolf

Update on the PCQR2 Subcommittee
Designed as a benchmarking tool, the PCQR2 allows board fabricators to assess their capabilities using a common set of tests and tools.
DB Mahnke Consulting, Duane Mahnke

D-15 Flex Test Methods Group Update
Mahnke provides a progress report on the D-15 committee which is designing test methods for flex materials.
DDI, Raj Kumar

Flat Wrap Technology Maturing
DDI introduced Flat Wrap Technology two years ago to address important via plating concerns on the PCB surface. Chief Technology Officer Raj Kumar discusses the progress his company has made with this technology aimed at helping PCB designers eliminate surface plating issues.
DfR Solutions, Cheryl Tulkoff

Lead-Free Reflow, PCB Degradation and the Influence of Moisture Absorption
Tulkoff explains the test methods and solutions that help ensure PCB quality relating to moisture absorption.
Dielectric Solutions, John Kuhn

Opening Eyes on Weave and CAF
Dielectric Solutions has developed a new glass system which promises to eliminate many of the headaches associated with traditional glass structures for laminates.
Dupont Company, David McGregor

Embedded Components - IPC D-50
This committee is responsible for assessing design, material, performance and test method needs of the printed board industry in terms of boards utilizing embedded component devices. David McGregor, Committee Chair, gives us an update on their progress.
IPC, Jack Fisher

IPC Roadmap Efforts Continue
Veteran PCB technologist Jack Fisher updates us on the latest progress with the roadmapping efforts at IPC.
Lockheed Martin, Mike Jouppi

IPC Gets Hot: Current-Carrying Capacity in Board Design
IPC just released a new design document: IPC-2152, "Standard for Determining Current-Carrying Capacity In Printed Board Design." Ten years in the making, the principal author, Mike Jouppi, discusses the features in the new document and why it's important, if not critical, for PCB designers and engineers.
NAVSEA, Jason Ferguson

Embedded Passives Test Methods Committee
A rough draft of this committee's latest test methods is now available. Jason Ferguson discusses the current committee status and the process used for developing the test methodologies.
Panasonic Electric Works, Tony Senese

3-11 Laminate/Prepreg Materials Subcommittee
The primary focus of this subcommittee is to improve base material performance and processing consistency via industry-accepted and user-friendly standards and test methods.
R&D Circuits, Tom Bresnan

Tom Bresnan provides an update on the D-20 High-Speed/High-Frequency Committee’s activities.
Tom Bresnan, vice chair of the High-Speed/High-Frequency Committee, explains how the committee supports manufacturers who use high-speed or high-frequency materials. As end-customers increasingly require high-speed materials, more and more volunteers are getting involved with D-20.
R&D Circuits, Tom Bresnan

R&D Circuits has been busy during the downturn.
While most have "hunkered down" R&D has been growing, investing in technology and preparing for the impending upturn.
STC Madison, Vern Solberg

Challenges in Building a High-Reliability Military PCB
The military industry continues to struggle with lead-free. Vern Solberg talks about some of the issues facing the defense industry and how it will have to adapt going forward.
Vulcan Flex Circuit Corp., Al Wasserzug

Impact of Converting Flex from HASL to RoHS-Compliant Surface Finishes
Although the transition from HASL to RoHS might sound easy, it isn't. Listen to Al Wasserzug as he explains some of things to consider as you make the move to a RoHS-compliant surface finish.
Vulcan Flex Circuit Corp., Al Wasserzug

PCB Executive Agent Task Force
The military has assigned an Executive Agent for the PCB industry. What are implications of this for the PCB industry?
Vulcan Flex Circuit Corp., Al Wasserzug

PCB Executive Management Steering Committee
Al Wasserzug discusses the planning process for the up-coming executive meeting, what's on the agenda and the value for PCB executives.
EMS
AIM, Karl Seelig - IPC, Fern Abrams

IPC Solder Products Value Council
Karl Seelig and Fern Abrams discuss the efforts of the Solder Products Value Council, along with some new challenges being pushed onto the industry regarding the origin of raw materials.
Brady Corporation, John Ciba

REACH, RoHS, TSCA -- What's Next?
Through organizations like the IPC, the electronics industry can develop the foundation for environmental compliance. John Ciba, Director Facilities, Environmental and Safety Engineering for the Brady Corporation talks about some of the initiatives which will help improve the way the industry responds and complies with old and new regulations.
Engelmaier Associates, Werner Engelmaier

Solder Creep-Fatigue Model Parameters for SAC and SnAg Lead-Free Solder Joint Reliability Estimation
Werner Engelmaier, "Mr. Reliability," discusses his paper presentation in detail with EMS007's Steve Gold.
IDEA, Debra Eggeman

Strategies for Fighting Counterfeit Components
The Independent Distributors of Electronics Association works to educate its customers on ways to avoid the dangers of counterfeit components, a problem that's estimated to cost OEMs billions of dollars each year.
IPC, Sharon Starr and Susan Filz

The IPC Electronic Industry Executive Summit
The IPC Electronic Industry Executive Summit is scheduled for October 21-22 in Scottsdale, Arizona. IPC's Sharon Starr, Director of Market Research and Susan Filz, Director of Industry Programs explain how the summit will provide PCB and EMS industry leadership with insights into the latest technologies and most critical markets.
Intertek, Walter Jager

International Environmental Standards for the Electronics Industry
The ECD standard (IEC 62430) specifies requirements and procedures to integrate environmental aspects into design and development processes. It provides a framework of ECD requirements and provides a level of alignment with emerging international regulations that will require an ECD process.
Nihon Superior USA, Keith Howell

Role of the Interfacial Intermetallic in Lead-Free Solders
Keith Howell discusses the role that the interfacial intermetallic plays with different solder alloys.
PWB Interconnect Solutions Inc., Paul Reid

Microvia Reliability Failure Modes
With the move to HDI, more and more microvia failures are rearing their ugly heads. Paul Reid talks about some of the root causes for these failures and some solutions.
Purdue University, Ganesh Subbarayan

Constitutive and Failure Behavior of Tin/Silver/Copper Solder Joints
Professor Subbarayan talks about Purdue University's efforts to understand the failure mechanisms for different lead-free solders.
Reynolds Consulting, Leo Reynolds

High-Performance Work Teams
Leo Reynolds, longtime industry veteran and EMS provider, talks about what it takes to create and sustain a high-performance business environment.
SAIC, Denny Fritz

Pb-Free Electronics Risk Management Consortium (PERM)
Denny Fritz describes the efforts of the Pb-Free Electronics Risk Management Consortium, a group formed by the aerospace and defense industries to tackle the critical issues surrounding lead-free.
STI Electronics, Mel Parrish

Product Assurance Committee Update
The Product Assurance Committee is working to develop standards and guidelines in support of OEMs and their suppliers.
Texas Instruments, Mark Frimann

IPC-175X Material Declaration Standard
With a new revision about to hit the street, Mark Frimann, committee co-chair, discusses the major changes incorporated into the new document.
Featured
AIM, Karl Seelig - IPC, Fern Abrams

IPC Solder Products Value Council
Karl Seelig and Fern Abrams discuss the efforts of the Solder Products Value Council, along with some new challenges being pushed onto the industry regarding the origin of raw materials.
CCNi, Don DeGroot

High Speed/High Frequency Test Methods Subcommittee
This subcommittee is tasked with developing test methods specifically for evaluating high-speed/high-frequency boards and materials. Don DeGroot talks about a breakthrough in the group's efforts to provide a comprehensive test solution.
Calumet, Stephen Marshall

Calumet is NOT waiting for the phone to ring.
The team at Calumet Electronics have taken the bull by the horns and developed the systems necessary to capture more business in a tough market. Stephen Marshall, National Sales Manager, talks about the strategic investments the company has made and their approach to capture new business and how they take care of their current customers.
DDI, Raj Kumar

Flat Wrap Technology Maturing
DDI introduced Flat Wrap Technology two years ago to address important via plating concerns on the PCB surface. Chief Technology Officer Raj Kumar discusses the progress his company has made with this technology aimed at helping PCB designers eliminate surface plating issues.
Engelmaier Associates, Werner Engelmaier

Solder Creep-Fatigue Model Parameters for SAC and SnAg Lead-Free Solder Joint Reliability Estimation
Werner Engelmaier, "Mr. Reliability," discusses his paper presentation in detail with EMS007's Steve Gold.
IDEA, Debra Eggeman

Strategies for Fighting Counterfeit Components
The Independent Distributors of Electronics Association works to educate its customers on ways to avoid the dangers of counterfeit components, a problem that's estimated to cost OEMs billions of dollars each year.
Lockheed Martin, Mike Jouppi

IPC Gets Hot: Current-Carrying Capacity in Board Design
IPC just released a new design document: IPC-2152, "Standard for Determining Current-Carrying Capacity In Printed Board Design." Ten years in the making, the principal author, Mike Jouppi, discusses the features in the new document and why it's important, if not critical, for PCB designers and engineers.
PWB Interconnect Solutions Inc., Paul Reid

Microvia Reliability Failure Modes
With the move to HDI, more and more microvia failures are rearing their ugly heads. Paul Reid talks about some of the root causes for these failures and some solutions.
R&D Circuits, Tom Bresnan

Tom Bresnan provides an update on the D-20 High-Speed/High-Frequency Committee’s activities.
Tom Bresnan, vice chair of the High-Speed/High-Frequency Committee, explains how the committee supports manufacturers who use high-speed or high-frequency materials. As end-customers increasingly require high-speed materials, more and more volunteers are getting involved with D-20.
Reynolds Consulting, Leo Reynolds

High-Performance Work Teams
Leo Reynolds, longtime industry veteran and EMS provider, talks about what it takes to create and sustain a high-performance business environment.
SAIC, Denny Fritz

Pb-Free Electronics Risk Management Consortium (PERM)
Denny Fritz describes the efforts of the Pb-Free Electronics Risk Management Consortium, a group formed by the aerospace and defense industries to tackle the critical issues surrounding lead-free.
Vulcan Flex Circuit Corp., Al Wasserzug

PCB Executive Agent Task Force
The military has assigned an Executive Agent for the PCB industry. What are implications of this for the PCB industry?
Events
Bare Board Group, Greg Papandrew

Out on the A-Line
In addition to a conference and exhibition, IPC Midwest featured the A-Line, a live assembly line – from bare board through assembled circuit board. Greg Papandrew discusses BBG’s role in the A-Line: providing the sample circuit board.
Fern Abrams and Greg Muni

It's Not Easy Being Green and IPC Materials Conference
IPC has co-joined two conferences the week of November 9-12. Speakers will address the ongoing and ever-changing environmental issues facing the industry, as well as materials compliance issues that electronics manufacturers must master to build the products of tomorrow.