Real Time With... SMTAI 2009
Video Index

Reflow temperatures that reach 260°C can cause through hole barrel failure. Conductor Analysis Technologies Vice President of Technical Marketing David Wolf discusses a paper he delivered at SMTAI 2009 that investigates via failure mechanisms and PWB supplier test data.

Consultant Sue Mucha co-organized a contract manufacturing symposium with Circuits Assembly magazine. She discusses the symposium content and why it was important for CM and OEM attendees.

ITM Consulting's Jim Hall was the 13th member of SMTA. He discusses how and why SMTA rose to prominence 25 years ago, and why it is a vital organization today

Joe Belmonte, formerly of Bose, has joined ITM Consulting. He sits down with ITM President Phil Zarrow to discuss their working relationship. The two also review the SMTA 25th Anniversary dinner, and look at how SMTA will remain relevant over the next quarter of a century.

First-time paper presenter Adam Stanczak, the global technolology manager for Molex, explains how a new solder attach method can help designers move away from traditional BGAs. His paper, aimed largely at PCB designers, explains design hardships and technology verifications for PCB assemblies.

Plexus Global Technology Manager Bill Barthel also serves as the SMTA Vice President of Technical Programs. He discusses the broad scope of this year's SMTAI Technical Conference and also reveals why he believes SMTA is an important and relevant industry association.

Military electronics faces two critical manufacturing issues: potentially procuring counterfeit components due to obselete parts and designs that demand leaded devices in a lead-free world. Premier Semiconductor Services President Hal Rotchadl delivered two papers covering these topics, and he discusses his suggestions for attacking these problems.

Process Engineer Glenn Robertson discusses some of the counterfeit component problems still causing pain in our industry. He explains the depth and breadth of counterfeiting, and some measures contract manufacturers can take to reduce risk when procuring components.

After canvassing five exhibitions in four weeks, Prototron Circuits President Dave Ryder is ready to capitalize on a recovering economy. He discusses staffing, focusing on new markets, and his company's reliance on quality as Prototron seeks to increase market share and decrease commodity pricing pressures.

OEM design teams are not as robust as they used to be, mainly due to attrition. As OEMs outsource more design functions, contract manufacturers are trying to fill the design void. Duane Benson of Screaming Circuits discusses his paper presentation, which addresses this topic.

Celestica has been working in partnership with IBM on copper dissolution. Their latest work addresses the impact of copper dissolution and the thinning of plating walls on reliability. Celestica Lead-Free Project Engineer Craig Hamilton explains.

Celestica worked with Amkor on a TMV package-on-package assembly study. They studied dip flux, dip paste and the corresponding drop test results. Hear from Celestica Senior Process Consultant Heather McCormick as she details the findings of this work.

Perhaps no topic has drawn more attendees at SMTAI than a session on head and pillow defects. Intel presented two papers, as did Session Chair and Christopher Associates Consulting Engineer Jasbir Bath. This interview offers an in-depth discussion of what's being done to minimize this perplexing proble

Dr. Ken Gilleo has earned accolades his entire career, starting as a self-professed "flex circuit guy" at Sheldahl. SMTA gave Dr. Gilleo one of its highest honors, the Founders Award. Find out some career highlights from a colorful industry personality.

Area array devices are proliferating throughout the industry. Henkel Director of Technical Services presented a paper that aimed to reduce materials science confusion. Find out how underfill systems can enhance the reliability of lead-free area array devices and what questions designers and process engineers might have about these material sets.

Technical Support Engineer Chris Anglin presents one in a series of papers on fine pitch stencil printing, "Sustaining a Fine Pitch Printing Process." He discusses a first-time focus on blade angle for better control of the print process. Anglin also looks at how to get the entire print process under control.

Indium Corporation Applications Engineer Jim Hisert reviews the content of his SMTAI 2009 paper presentation. He discusses PoP materials evaluation criteria, and some other insights gleaned from his research.

As assemblies get smaller and smaller, parts are being stressed and warpage occurs. Microwave curing technology is now becoming a useful technique for flip chip assembly. Dr. Bob Hubbard of Lambda Technologies explains why.

First-time paper presenter Adam Stanczak, the global technolology manager for Molex, explains how a new solder attach method can help designers move away from traditional BGAs. His paper, aimed largely at PCB designers, explains design hardships and technology verifications for PCB assemblies.

Phil Marcoux is one of SMT's founding fathers, having set up the first SMT operation in the U.S. As the opening presenter, he provided information on the SMT sector's past, and he offers a glimpse of where the industry might head in the future.

Plexus Global Technology Manager Bill Barthel also serves as the SMTA Vice President of Technical Programs. He discusses the broad scope of this year's SMTAI Technical Conference and also reveals why he believes SMTA is an important and relevant industry association.

Military electronics faces two critical manufacturing issues: potentially procuring counterfeit components due to obselete parts and designs that demand leaded devices in a lead-free world. Premier Semiconductor Services President Hal Rotchadl delivered two papers covering these topics, and he discusses his suggestions for attacking these problems.

Process Engineer Glenn Robertson discusses some of the counterfeit component problems still causing pain in our industry. He explains the depth and breadth of counterfeiting, and some measures contract manufacturers can take to reduce risk when procuring components.

Sanmina-SCI is looking at markets that will complement its electronics manufacturing and final assembly competencies. Senior Vice President of Technology and Custom Engineering explains the "significant" opportunity represented by the alternative energy market, particularly solar.

The SMTA Spacecoast Chapter is the new chapter on the block. Even so, it took home an award this week and had an active leadership. President Eileen Hibbler discusses the groups next big event in Orlando at the end of October.

New iNEMI CEO Bill Bader understands that international scope is important to his association. He hopes to grow the research focus of iNEMI, but not without an eye towards quantifiable results.

Celestica has been working in partnership with IBM on copper dissolution. Their latest work addresses the impact of copper dissolution and the thinning of plating walls on reliability. Celestica Lead-Free Project Engineer Craig Hamilton explains.

Celestica worked with Amkor on a TMV package-on-package assembly study. They studied dip flux, dip paste and the corresponding drop test results. Hear from Celestica Senior Process Consultant Heather McCormick as she details the findings of this work.

Perhaps no topic has drawn more attendees at SMTAI than a session on head and pillow defects. Intel presented two papers, as did Session Chair and Christopher Associates Consulting Engineer Jasbir Bath. This interview offers an in-depth discussion of what's being done to minimize this perplexing proble

Dr. Ken Gilleo has earned accolades his entire career, starting as a self-professed "flex circuit guy" at Sheldahl. SMTA gave Dr. Gilleo one of its highest honors, the Founders Award. Find out some career highlights from a colorful industry personality.

Solder usage reduction can be done through minimizing dross. Industry consultant and P Kay Metals Vice President Dan Feinberg offers his perspective of the Mexican and Chinese markets. He also updates viewers on the status of several pending patents around the world

Area array devices are proliferating throughout the industry. Henkel Director of Technical Services presented a paper that aimed to reduce materials science confusion. Find out how underfill systems can enhance the reliability of lead-free area array devices and what questions designers and process engineers might have about these material sets.

Technical Support Engineer Chris Anglin presents one in a series of papers on fine pitch stencil printing, "Sustaining a Fine Pitch Printing Process." He discusses a first-time focus on blade angle for better control of the print process. Anglin also looks at how to get the entire print process under control.

Indium Corporation Applications Engineer Jim Hisert reviews the content of his SMTAI 2009 paper presentation. He discusses PoP materials evaluation criteria, and some other insights gleaned from his research.

A look at two paper presentations by Kyzen Chief Technology Officer Mike Bixenman. The first paper looks at ionic cleanliness testers and evolving flux materials. The second paper seeks to optimize a batch cleaning process for quad flat no-lead modules (QFMs).

As assemblies get smaller and smaller, parts are being stressed and warpage occurs. Microwave curing technology is now becoming a useful technique for flip chip assembly. Dr. Bob Hubbard of Lambda Technologies explains why.

This show floor interview looks at something you didn't see much of at SMTAI: a new product introduction. Manncorp Sales Manager Ed Stone discusses his company's new mid-volume pick-and-place machine with a small footprint.

This show floor interview looks at what OrproVision has accomplished since purchasing Orbotech's Electronics Assembly AOI line.

Phil Marcoux is one of SMT's founding fathers, having set up the first SMT operation in the U.S. As the opening presenter, he provided information on the SMT sector's past, and he offers a glimpse of where the industry might head in the future.

Along with the need for boards sourced in Asiacome quality concerns. Peregrine Semiconductor Senior Quality Engineer Mumtaz Bora lets viewers no what she's looking for in her Chinese and Asian PWB Suppliers.

Sanmina-SCI is looking at markets that will complement its electronics manufacturing and final assembly competencies. Senior Vice President of Technology and Custom Engineering explains the "significant" opportunity represented by the alternative energy market, particularly solar.

The SMTA Spacecoast Chapter is the new chapter on the block. Even so, it took home an award this week and had an active leadership. President Eileen Hibbler discusses the groups next big event in Orlando at the end of October.

Why is the 25th anniversary of the SMTA a big deal? For that matter, why is the SMTA important? TechLead Corporation's Dr. Charles Bauer has helped the association evolve over the last quarter of a century. He discusses some milestones and why SMTA is so special to its members.

Industry specialist Bob Willis discusses his workshop content delivered at SMTAI 2009. Along with a package-on-package course that addressed manufacturing issues and vision inspection techniques, he also discusses counterfeit components and future workshop content.

New iNEMI CEO Bill Bader understands that international scope is important to his association. He hopes to grow the research focus of iNEMI, but not without an eye towards quantifiable results.

What happens when an overworked online editor reaches the end of his rope? Get a glimpse of a man falling apart in this behind-the-scenes Real Time with SMTAI outtake reel.

An additional award was be presented this year to Steve Gold of I-Connect007. This Exceptional Contribution Award recognizes Steve for the countless hours he spent capturing, editing, and formatting the SMTA's Membership Video Testimonials.